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1

Role of 1,2-benzisothiazolin-3-one (BIT) in the Improvement of Barrier CMP Performance with Alkaline Slurry

Ma, Tengda, Tan, Baimei, Liu, Yuling, Niu, Xinhuan, Liu, Guorui, Wang, Chenwei, Luo, Chong, Xu, Yi, Kao, Zhengxiao

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

Language:

english

File:

PDF, 1.39 MB

english, 2019

2

Distribution of Ge in high concentration Ge-doped Czochralski-Si crystal

Xinhuan Niu, Weilian Zhang, Guoqi Lu, Zhongwei Jiang

Journal:

Journal of Crystal Growth

Year:

2004

Language:

english

File:

PDF, 193 KB

english, 2004

3

Effect of Chloride Ions on the Chemical Mechanical Planarization Efficiency of Sapphire Substrate

Cui, Yaqi, Niu, XinHuan, Zhou, Jiakai, Wang, Zhi, Wang, Ru, Zhang, Jin

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

Language:

english

File:

PDF, 1.18 MB

english, 2019

4

FTIR spectroscopy of high concentration Ge-doped Czochralski-Si

Xinhuan Niu, Weilian Zhang, Enhuai Zhang, Junsheng Sun, Guoqi Lu

Journal:

Journal of Crystal Growth

Year:

2004

Language:

english

File:

PDF, 310 KB

english, 2004

5

Effect of a novel chelating agent on defect removal during post-CMP cleaning

Hong, Jiao, Niu, Xinhuan, Liu, Yuling, He, Yangang, Zhang, Baoguo, Wang, Juan, Han, Liying, Yan, Chenqi, Zhang, Jin

Journal:

Applied Surface Science

Year:

2016

Language:

english

File:

PDF, 585 KB

english, 2016

6

Investigation of the barrier slurry with better defect performance and facilitating post-CMP cleaning

Luan, Xiaodong, Liu, Yuling, Zhang, Baoguo, Wang, Shengli, Niu, Xinhuan, Wang, Chenwei, Wang, Juan

Journal:

Microelectronic Engineering

Year:

2017

Language:

english

File:

PDF, 2.04 MB

english, 2017

7

Application of surfactant for facilitating benzotriazole removal and inhibiting copper corrosion during post-CMP cleaning

Tang, Jiying, Liu, Yuling, Wang, Chenwei, Niu, Xinhuan, Tan, Baimei, Gao, Baohong

Journal:

Microelectronic Engineering

Year:

2018

Language:

english

File:

PDF, 1.09 MB

english, 2018

8

Effect of pH Value and Glycine in Alkaline CMP Slurry on the Corrosion of Aluminum by Electrochemical Analysis

Wang, Zhi, Sun, Ming, Niu, Xinhuan, Zhou, Jiakai, Cui, Yaqi

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

Language:

english

File:

PDF, 934 KB

english, 2019

9

Dexmedetomidine modulates neuroinflammation and improves outcome via alpha2-adrenergic receptor signaling after rat spinal cord injury

Gao, Jiandong, Sun, Zhihua, Xiao, Zhaoyang, Du, Qihang, Niu, Xinhuan, Wang, Gongming, Chang, Yu-Wen, Sun, Yongtao, Sun, Wei, Lin, Amity, Bresnahan, Jacqueline C., Maze, Mervyn, Beattie, Michael S., Pa

Journal:

British Journal of Anaesthesia

Year:

2019

Language:

english

File:

PDF, 1.69 MB

english, 2019

10

The physiological functions and pharmaceutical applications of inulin: A review

Wan, Xinhuan, Guo, Hao, Liang, Yiyu, Zhou, Changzheng, Liu, Zihao, Li, Kunwei, Niu, Fengju, Zhai, Xin, Wang, Lizhu

Journal:

Carbohydrate Polymers

Year:

2020

File:

PDF, 3.89 MB

2020

11

Anisotropy of the Seebeck coefficient in Czochralski grown p-type SiGe single crystal

Zhongwei Jiang, Weilian Zhang, Liqin Yan, Xinhuan Niu

Journal:

Materials Science and Engineering: B

Year:

2005

Language:

english

File:

PDF, 89 KB

english, 2005

12

Infrared measurement of Ge concentration in CZ–Si

Zhongwei Jiang, Weilian Zhang, Xinhuan Niu, Liqin Yan

Journal:

Journal of Crystal Growth

Year:

2005

Language:

english

File:

PDF, 210 KB

english, 2005

13

A study on the comparison of CMP performance between a novel alkaline slurry and a commercial slurry for barrier removal

Chenwei Wang, Yuling Liu, Jianying Tian, Baohong Gao, Xinhuan Niu

Journal:

Microelectronic Engineering

Year:

2012

Language:

english

File:

PDF, 1.00 MB

english, 2012

14

Chemical mechanical planarization of barrier layers by using a weakly alkaline slurry

Wang, Chenwei, Gao, Jiaojiao, Tian, Jianying, Niu, Xinhuan, Liu, Yuling

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1.52 MB

english, 2013

15

An advanced alkaline slurry for barrier chemical mechanical planarization on patterned wafers

Wang, Chenwei, Liu, Yuling, Niu, Xinhuan, Tian, Jianying, Gao, Baohong, Zhang, Xiaoqiang

Journal:

Journal of Semiconductors

Year:

2012

Language:

english

File:

PDF, 333 KB

english, 2012

16

Protective Effect of FTY720 Against Sevoflurane-Induced Developmental Neurotoxicity in Rats

Hui Zhou, Song Li, Xinhuan Niu, Ping Wang, Junnan Wang…

Journal:

Cell Biochemistry and Biophysics

Year:

2013

Language:

english

File:

PDF, 431 KB

english, 2013

17

The Effects of Hispidulin on Bupivacaine-Induced Neurotoxicity: Role of AMPK Signaling Pathway

Niu, Xinhuan, Chen, Jie, Wang, Ping, Zhou, Hui, Li, Song, Zhang, Mengyuan

Journal:

Cell Biochemistry and Biophysics

Year:

2014

Language:

english

File:

PDF, 1.90 MB

english, 2014

18

[IEEE 2008 9th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT) - Beijing, China (2008.10.20-2008.10.23)] 2008 9th International Conference on Solid-State and Integrated-Circuit Technology - Influence of surfactant on Si{111} etched surface

Xinhuan Niu,, Baimei Tan,, Simiao Zong,, Yuling Liu,

Year:

2008

Language:

english

File:

PDF, 1.12 MB

english, 2008

19

[IEEE 2009 First International Conference on Information Science and Engineering - Nanjing, China (2009.12.26-2009.12.28)] 2009 First International Conference on Information Science and Engineering - Research on the Decision Support System of the Management for Equipment Maintenance

Yang, Bensheng, Zhao, Xinhuan, Wang, Qiaoyun, Niu, Shenxia

Year:

2009

Language:

english

File:

PDF, 258 KB

english, 2009

20

[IEEE 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Xian, China (2012.10.29-2012.11.1)] 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology - Achievement of non-selectivity barrier slurry by adding H3PO4 and its application in patterned wafers CMP

Niu, Xinhuan, Wang, Chenwei, Wang, Juan, Lu, Guoqi, Liu, Yuling

Year:

2012

Language:

english

File:

PDF, 365 KB

english, 2012

21

Effect of three kinds of guanidinium salt on the properties of a novel low-abrasive alkaline slurry for barrier CMP

Chen, Guodong, Liu, Yuling, Niu, Xinhuan

Journal:

Journal of Semiconductors

Year:

2014

Language:

english

File:

PDF, 1.29 MB

english, 2014

22

ECS Transactions [ECS China Semiconductor Technology International Conference 2010 (CSTIC 2010) - Shanghai, China (March 18 - March 19, 2010)] - Study on Surface State Control Technique of InSb Material Ultraprecision Machining

Niu, Xinhuan, Tan, Baimei, Xu, Wenzhong, Zhao, Haitao, Liu, Yuling

Year:

2010

Language:

english

File:

PDF, 239 KB

english, 2010

23

ECS Transactions [ECS China Semiconductor Technology International Conference 2010 (CSTIC 2010) - Shanghai, China (March 18 - March 19, 2010)] - Influence of Abrasive on CMP Quality for NiP Substrate of Computer Hard-Disk

Tan, Baimei, Niu, Xinhuan, Bian, Na, Chen, Haitao, Liu, Yuling

Year:

2010

Language:

english

File:

PDF, 903 KB

english, 2010

24

Application of a macromolecular chelating agent in chemical mechanical polishing of copper film under the condition of low pressure and low abrasive concentration

Li, Yan, Liu, Yuling, Niu, Xinhuan, Bu, Xiaofeng, Li, Hongbo, Tang, Jiying, Fan, Shiyan

Journal:

Journal of Semiconductors

Year:

2014

Language:

english

File:

PDF, 4.27 MB

english, 2014

25

Removal of residual CuO particles on the post CMP wafer surface of multi-layered copper

Li, Yan, Sun, Ming, Niu, Xinhuan, Liu, Yuling, He, Yangang, Li, Hailong, Wang, Aochen, Li, Hongbo

Journal:

Journal of Semiconductors

Year:

2014

Language:

english

File:

PDF, 7.41 MB

english, 2014

26

Planarization properties of an alkaline slurry without an inhibitor on copper patterned wafer CMP

Wang, Chenwei, Liu, Yuling, Tian, Jianying, Niu, Xinhuan, Zheng, Weiyan, Yue, Hongwei

Journal:

Journal of Semiconductors

Year:

2012

Language:

english

File:

PDF, 730 KB

english, 2012

27

[ECS ISTC/CSTIC 2009 (CISTC) - Shanghai, China (March 19 - March 20, 2009)] ECS Transactions - Application of Surfactant in Si CMP Processing

Tan, Baimei, Niu, Xinhuan, Liang, Pu, Wu, Tao, Liu, Y. L.

Year:

2009

Language:

english

File:

PDF, 638 KB

english, 2009

28

[ECS ISTC/CSTIC 2009 (CISTC) - Shanghai, China (March 19 - March 20, 2009)] ECS Transactions - Study on CMP Mechanism and Technology of Sapphire Substrate for Photo-conducting Device

Niu, Xinhuan, Wu, Tao, Zhao, Xiaohong, Tan, Baimei, Liu, Y. L.

Year:

2009

Language:

english

File:

PDF, 583 KB

english, 2009

29

[ECS ISTC/CSTIC 2009 (CISTC) - Shanghai, China (March 19 - March 20, 2009)] ECS Transactions - Study On The Electro-Chemical Cleaning Technique with BDD Film Anode to Preparation of Electronic Devices

Gao, Baohong, Zhu, Yadong, Liu, Yuling, Niu, Xinhuan, Zhang, Jianxin, Liu, Xiaoyan, Li, Li

Year:

2009

Language:

english

File:

PDF, 264 KB

english, 2009

30

Mechanism of the development of a weakly alkaline barrier slurry without BTA and oxidizer

Luan, Xiaodong, Liu, Yuling, Niu, Xinhuan, Wang, Juan

Journal:

Journal of Semiconductors

Year:

2015

Language:

english

File:

PDF, 2.55 MB

english, 2015

31

[IEEE 2010 2nd International Conference on Networking and Digital Society (ICNDS) - Wenzhou, China (2010.05.30-2010.05.31)] 2010 International Conference on Networking and Digital Society - Research of coal mine equipments management system based on WEBGIS

Yang Bensheng,, Niu Shenxia,, Zhao Xinhuan,

Year:

2010

Language:

english

File:

PDF, 628 KB

english, 2010

32

A study on exploring the alkaline copper CMP slurry without inhibitors to achieve high planarization efficiency

Luan, Xiaodong, Liu, Yuling, Wang, Chenwei, Niu, Xinhuan, Wang, Juan, Zhang, Wenqian

Journal:

Microelectronic Engineering

Year:

2016

Language:

english

File:

PDF, 1.37 MB

english, 2016

33

A novel kind of TSV slurry with guanidine hydrochloride

Hong, Jiao, Liu, Yuling, Zhang, Baoguo, Niu, Xinhuan, Han, Liying

Journal:

Journal of Semiconductors

Year:

2015

Language:

english

File:

PDF, 1.55 MB

english, 2015

34

Removal rate and surface quality of the GLSI silicon substrate during the CMP process

Hong, Jiao, Niu, Xinhuan, Liu, Yuling, Wang, Chenwei, Zhang, Baoguo, Sun, Ming, Wang, Juan, Han, Liying, Zhang, Wenqian

Journal:

Microelectronic Engineering

Year:

2017

Language:

english

File:

PDF, 1.57 MB

english, 2017

35

Photonics-Based Wideband Microwave Phase Shifter

Wang, Xudong, Niu, Tong, Chan, Erwin H.W., Feng, Xinhuan, Guan, Bai-ou, Yao, Jianping

Journal:

IEEE Photonics Journal

Year:

2017

Language:

english

File:

PDF, 911 KB

english, 2017

36

Research on Si (100) Crystal Substrate CMP Based on FA/O alkaline slurry

Hong, Jiao, Niu, Xinhuan, Wang, Juan, Wang, Chenwei, Zhang, Baoguo, Wang, Ru, Sun, Ming, Liu, Yuling

Journal:

Applied Surface Science

Year:

2017

Language:

english

File:

PDF, 288 KB

english, 2017

37

Effect of Non-Ionic Surfactant on Copper Dishing and Dielectric Erosion Correction in Alkaline Barrier CMP Solution Free of Inhibitors

Zhang, Wenqian, Liu, Yuling, Wang, Chenwei, Gao, Jiaojiao, Niu, Xinhuan, Wang, Juan

Journal:

ECS Journal of Solid State Science and Technology

Year:

2017

Language:

english

File:

PDF, 908 KB

english, 2017

38

Study on the Weakly Alkaline Slurry of Copper Chemical Mechanical Planarization for GLSI

Yao, Caihong, Niu, Xinhuan, Wang, Chenwei, Liu, Yuling, Jiang, Zichao, Wang, Yan, Tian, Shengjun

Journal:

ECS Journal of Solid State Science and Technology

Year:

2017

Language:

english

File:

PDF, 1.33 MB

english, 2017

39

A new kind of chelating agent with low pH value applied in the TSV CMP slurry

Hong, Jiao, Liu, Yuling, Zhang, Baoguo, Niu, Xinhuan, Han, Liying

Journal:

Journal of Semiconductors

Year:

2015

Language:

english

File:

PDF, 1.60 MB

english, 2015

40

Role of a New Type Chelating Agent in Chemical Mechanical Polishing of R-Plane Sapphire Substrate

Zhao, Xin, Niu, Xinhuan, Wang, Jianchao, Yin, Da, Yao, Caihong

Journal:

ECS Journal of Solid State Science and Technology

Year:

2017

Language:

english

File:

PDF, 1.45 MB

english, 2017

41

Effect of a pH Regulator on Sapphire Substrate CMP

Wang, Jianchao, Niu, Xinhuan, Zhao, Xin, Liu, Yuling

Journal:

ECS Journal of Solid State Science and Technology

Year:

2017

Language:

english

File:

PDF, 1.04 MB

english, 2017

42

Role of 1,2,4-Triazole in Co/Cu Removal Rate Selectivity and Galvanic Corrosion during Barrier CMP

Zhang, Wenqian, Liu, Yuling, Wang, Chenwei, Niu, Xinhuan, Ji, Jun, Du, Yichen, Han, Linan

Journal:

ECS Journal of Solid State Science and Technology

Year:

2017

Language:

english

File:

PDF, 1.40 MB

english, 2017

43

Research on R-Plane Sapphire Substrate CMP Removal Rate Based on a New-Type Alkaline Slurry

Zhao, Xin, Niu, Xinhuan, Yin, Da, Wang, Jianchao, Zhang, Kai

Journal:

ECS Journal of Solid State Science and Technology

Year:

2018

Language:

english

File:

PDF, 1.39 MB

english, 2018

44

The stability of a novel weakly alkaline slurry of copper interconnection CMPfor GLSI

Yao, Caihong, Wang, Chenwei, Niu, Xinhuan, Wang, Yan, Tian, Shengjun, Jiang, Zichao, Liu, Yuling

Journal:

Journal of Semiconductors

Year:

2018

Language:

english

File:

PDF, 7.56 MB

english, 2018

45

Preparation of MgO doped colloidal SiO 2 abrasive and their chemical mechanical polishing performance on c-, r- and a-plane sapphire substrate

Yin, Da, Niu, Xinhuan, Zhang, Kai, Wang, Jianchao, Cui, Yaqi

Journal:

Ceramics International

Year:

2018

Language:

english

File:

PDF, 1.38 MB

english, 2018

46

Role of Dispersant Agent on Scratch Reduction during Copper Barrier Chemical Mechanical Planarization

Li, Yanlei, Liu, Yuling, Wang, Chenwei, Niu, Xinhuan, Ma, Tengda, Xu, Yi

Journal:

ECS Journal of Solid State Science and Technology

Year:

2018

Language:

english

File:

PDF, 867 KB

english, 2018

47

Improvement of Barrier CMP Performance with Alkaline Slurry: Role of Ionic Strength

Wang, Jianchao, Niu, Xinhuan, Liu, Yuling, Wang, Chenwei, Yang, Shenghua, Zhang, Kai, Xu, Yi, Ma, Tengda, Zhang, Wenqian

Journal:

ECS Journal of Solid State Science and Technology

Year:

2018

File:

PDF, 907 KB

2018

48

Improvement of Barrier CMP Performance with Alkaline Slurry: Role of Ionic Strength

Wang, Jianchao, Niu, Xinhuan, Liu, Yuling, Wang, Chenwei, Yang, Shenghua, Zhang, Kai, Xu, Yi, Ma, Tengda, Zhang, Wenqian

Journal:

ECS Journal of Solid State Science and Technology

Year:

2018

Language:

english

File:

PDF, 907 KB

english, 2018

49

Effect of Chelating Agent and Ammonium Dodecyl Sulfate on the Interfacial Behavior of Copper CMP for GLSI

Zhang, Kai, Niu, Xinhuan, Wang, Chenwei, Wang, Jianchao, Yin, Da, Wang, Ru

Journal:

ECS Journal of Solid State Science and Technology

Year:

2018

Language:

english

File:

PDF, 1.15 MB

english, 2018

50

Controlling the Removal Rate Selectivity of Ruthenium to Copper during CMP by Using Guanidine Carbonate and 1, 2, 4-Triazole

Wang, Qingwei, Zhou, Jianwei, Wang, Chenwei, Niu, Xinhuan, Tian, Qiyuan, Xiao, Yue, Wang, Ru

Journal:

ECS Journal of Solid State Science and Technology

Year:

2018

Language:

english

File:

PDF, 1.32 MB

english, 2018

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